全新原装现货库存，量大从优
Advanced Process Technology
Dynamic dv/dt Rating
175°C Operating TemperaturelFast Switching
Fully Avalanche RatedlEase of Paralleling
Simple Drive Requirements
Lead-Free
Description
Fifth Generation HEXFET® Power MOSFETs fromInternational Rectifier utilize advanced processingtechniques to achieve extremely low on-resistance persilicon area.
This benefit, combined with the fast switchingspeed and ruggedized device design that HEXFET PowerMOSFETs are well known for,
provides the designer with anextremely efficient and reliable device for use in a widevariety of applications.
The TO-220 package is universally preferred for allcommercial-industrial applications at power dissipation levelsto approximately 50 watts. The low thermal resistance andlow package cost of the TO-220 contribute to its wideacceptance throughout the industry.
The D2Pak is a surface mount power package capable ofaccommodating die sizes up to HEX-4. It provides thehighest power capability and the lowest possible on-resistance in any existing surface mount package. TheD2Pak is suitable for high current applications because of itslow internal connection resistance and can dissipate up to2.0W in a typical surface mount application.
The through-hole version (IRF630NL) is available for low-profile application.
